Adaptable storage bay for solid state drives

ABSTRACT

A solid state drive (SSD) storage bay includes storage trays and connector cards. A storage tray has a an interposer and an SSD module. A connector of the interposer is connected to a connector of the SSD module, and another connector of the interposer is connected to a connector of a connector card. The connector card includes terminals that connect to a bus of a computer system. The interposer includes wirings that allow electrical signals to propagate between the two connectors of the interposer. The interposer includes circuitry that allow for voltage regulation of supply voltage, level shifting, and hot-swapping.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.16/138,793, filed Sep. 21, 2018, which is incorporated herein byreference in its entirety.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates generally to computer systems, and moreparticularly but not exclusively to storage devices.

2. Description of the Background Art

As is well known, a computer drive is a storage device used by computersystems. Solid state drives, such as those with integrated circuit (IC)non-volatile memory (e.g., non-volatile flash memory), are much fasterthan conventional electro-mechanical hard disk drives. Solid statedrives with IC non-volatile memory are referred to herein as SSDmodules. For example, the Non-Volatile Memory Express (NVME)specification provides for accessing solid state drives that areattached to a computer system by way of a Peripheral ControllerInterconnect Express (PCIE) bus.

SSD modules that comply with the NVME specification are referred toherein as NVME modules. In computer systems that require large amountsof storage space, NVME modules may be installed in dedicated storagebays. For example, NVME modules may be mounted in corresponding storagetrays, which are removably attached to a storage bay. Examples ofstorage bays for NVME modules include the SUPERMICRO® NVME platforms,which are commercially-available from Super Micro Computer, Inc. of SanJose, Calif.

SUMMARY

In one embodiment, a solid state drive (SSD) storage bay includesstorage trays and connector cards. A storage tray has a an interposerand an SSD module. A connector of the interposer is connected to aconnector of the SSD module, and another connector of the interposer isconnected to a connector of a connector card. The connector cardincludes terminals that connect to a bus of a computer system. Theinterposer includes wirings that allow electrical signals to propagatebetween the two connectors of the interposer. The interposer includescircuitry that allow for voltage regulation of supply voltage, levelshifting, and hot-swapping.

These and other features of the present invention will be readilyapparent to persons of ordinary skill in the art upon reading theentirety of this disclosure, which includes the accompanying drawingsand claims.

DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a partial perspective view of a storage bay in accordancewith an embodiment of the present invention.

FIG. 2 shows a schematic diagram of the storage bay of FIG. 1 asattached to a computer system in accordance with an embodiment of thepresent invention.

FIGS. 3 and 4 show a perspective view and an exploded view,respectively, of a storage tray in accordance with an embodiment of thepresent invention.

FIG. 5 shows a multi-view of the storage tray of FIGS. 3 and 4 inaccordance with an embodiment of the present invention.

FIG. 6 is a larger drawing of an edge view of FIG. 5.

FIG. 7 shows a top view of a plurality of storage trays in accordancewith an embodiment of the present invention.

FIG. 8 shows an arrangement of an SSD module, an interposer, and aconnector card in accordance with an embodiment of the presentinvention.

FIG. 9 shows an arrangement of an SSD module, an interposer, and aconnector card in accordance with another embodiment of the presentinvention.

FIG. 10 shows a schematic diagram of an interposer in accordance with anembodiment of the present invention.

The use of the same reference label in different drawings indicates thesame or like components. Drawings are not necessarily to scale unlessotherwise noted.

DETAILED DESCRIPTION

In the present disclosure, numerous specific details are provided, suchas examples of systems, components, and methods, to provide a thoroughunderstanding of embodiments of the invention. Persons of ordinary skillin the art will recognize, however, that the invention can be practicedwithout one or more of the specific details. In other instances,well-known details are not shown or described to avoid obscuring aspectsof the invention.

FIG. 1 shows a partial perspective view of a storage bay 100 inaccordance with an embodiment of the present invention. In the exampleof FIG. 1, the storage bay 100 includes a chassis (not shown) thatallows the storage bay 100 to be mounted on an equipment rack along withother storage bays. The storage bay 100 may include a plurality ofconnector cards 110 and a plurality of storage trays 150, 130. Only someof the connector cards 110 and corresponding bay connectors 112 arelabeled in FIG. 1 for clarity of illustration. The storage trays 150,130 are in so-called vertical mounting configuration relative to ahorizontally-mounted motherboard 114 (see also FIGS. 2, 8, and 9), whichmay comprise a printed circuit board (PCB). In the present disclosure,“horizontal” and “vertical” are relative to the floor of the computerroom in which the storage bay 100 is deployed.

FIG. 2 shows a schematic diagram of the storage bay 100 as attached to acomputer system 190 in accordance with an embodiment of the presentinvention. Generally speaking, a connector card 110 is configured toallow a storage tray 150 or 130 to be mechanically and electricallyconnected to a computer bus 191 of the computer system 190. Only thestorage tray 150 is shown in FIG. 2 for clarity of illustration. In theexample of FIG. 2, the computer system 190 includes one or moreprocessors 192, main memory 193 (e.g., random-access memory), and othercomponents. The computer system 190 is commercially-available fromvarious computer vendors, such as Super Micro Computer, Inc. of SanJose, Calif.

A connector card 110 comprises a bay connector 112 and an array of bayterminals 113 (see also FIGS. 8 and 9). The bay connector 112 isconfigured to removably mate with a tray connector 171, 131 of acorresponding storage tray 150, 130. In one embodiment, the bayconnector 112 is a slot-type connector, which is configured to receivean edge-type tray connector 171, 131. The bay terminals (e.g., pins) 113of a connector card 110 are configured to be connected to the computerbus 191. In one embodiment, the bay terminals 113 are configured to befixedly connected (e.g., soldered) to corresponding pins of a PCIE buson the motherboard 114. The bay terminals 113 may also be part of a PCIEconnector that is removably connected to a corresponding PCIE connectoron the motherboard 114.

Referring back to the example of FIG. 1, a storage tray 150, 130comprises an SSD module, which in one embodiment is an NVME module.Generally speaking, a particular computer vendor expects a storage trayto comply with certain mechanical and electrical requirements to becompatible with that vendor's storage bays. Deviating from therequirements prevents a storage tray from being installed in the storagebay of that particular computer vendor.

In the example of FIG. 1, the storage tray 130 is a conventional storagetray. Some storage trays 130 may comply with the so-calledNext-generation Small Form Factor (NGSFF) specification promulgated bythe Samsung™ company. In such storage trays 130, the tray connector 131is an NGSFF connector. Other storage trays 130 may comply with theso-called Enterprise and Data Center Solid State Drive Form Factor(EDSFF) specification promulgated by the Intel™ corporation and othercomputer vendors. In that case, the tray connector 131 is an EDSFFconnector.

A problem with conventional storage trays is that the NGSFF and ESDFFspecifications are not mechanically and electrically compatible witheach other. In other words, a storage tray 130 that complies with theNGSFF specification cannot be installed in a storage bay that complieswith the EDSFF specification, and vice versa. More particularly, theNGSFF and ESDFF specifications require different connector types,pinouts, etc. Therefore, for cost and compatibility reasons, anenterprise customer has to commit to, and thus be limited by, aparticular form factor specification. Another problem with conventionalstorage trays is that they do not provide adequate thermal management,which may result in heat build-up in storage bays that contain severalstorage trays.

FIGS. 3 and 4 show a perspective view and an exploded view,respectively, of the storage tray 150 in accordance with an embodimentof the present invention. As shown in FIGS. 3 and 4, the storage tray150 may comprise a frame 151, an SSD module 120, and an interposer 170.These features of the storage tray 150 are also labeled in FIG. 1 fororientation purposes.

Referring first to the perspective view of FIG. 3, the frame 151 maycomprise a plate 157 to which the SSD module 120 and the interposer 170are mounted. The SSD module 120 may be fastened to the plate 157 by ascrew 162, and the interposer 170 may be fastened to the plate 157 by ascrew 158. Standoffs (see FIGS. 4, 159 and 161) between the plate 157and the SSD module 120 and interposer 170 allow for directed air-flowthrough the storage tray 150. An ejector 160 provides a lever thatfacilitates insertion and removal of the storage tray 150 into and outof the storage bay 100. The ejector 160 is rotatably attached to a pointon the frame 151, and may be actuated by swinging the ejector 160.

To install the storage tray 150 into the storage bay 100, the trayconnector 171 is inserted into a bay connector 112 of a correspondingconnector card 110. This mechanically connects the terminals of the trayconnector 171 to the terminals of the bay connector 112, therebyestablishing an electrical connection between components of the SSDmodule 120 and the computer system 190 by way of the computer bus 191(see FIG. 2). In this example where the SSD module 120 is an NVMEmodule, the computer system 190 communicates with the SSD module 120 inaccordance with the NVME specification.

For ease of illustration, components previously described with referenceto FIG. 3 are also labeled in the exploded view of FIG. 4. As shown inFIG. 4, the plate 157 may have a raised portion 156 that has a pluralityof mounting holes 153-155. This configuration allows the frame 151 toaccommodate different sizes of SSD modules 120. More particularly, astandoff 161 may be attached to one of the mounting holes 153-155 tosecure an SSD module 120 of a particular size. A notch 122 (e.g., on thecircuit board) of an SSD module 120 may be secured between the standoff161 and the screw 162. A corresponding screw 165 may be used to fastenthe standoff 161 into the mounting hole 153, or other mounting holedepending on the dimensions of the SSD module 120. The SSD module 120includes an edge-type connector 121, which is removably inserted into aslot-type connector 172 of the interposer 170. In one embodiment, theSSD module 120 is an NVME module that is compliant with the M.2 formfactor specification. Accordingly, the connector 121 may be an M.2connector. Generally speaking, the M.2 form factor specification allowsSSD modules to have widths of 12 mm, 16 mm, 22 mm, and 30 mm, andlengths of 16 mm, 26 mm, 30 mm, 38 mm, 42 mm, 60 mm, 80 mm, and 110 mm.For illustration purposes only, the example of FIG. 4 shows an SSDmodule 120 with dimensions of 22 mm×80 mm (width×length), having a notch122 that is secured to the standoff 161, which is mounted on themounting hole 153. In one embodiment, an SSD module 120 is acommercially-available SSD module that complies with the NVME and M.2specifications.

In one embodiment, the interposer 170 comprises a circuit card 173(e.g., PCB), the connector 172, and the tray connector 171. Theconnector 172 is mounted on the circuit 173 on a vertical edge of thecircuit card 173, and the tray connector 171 is mounted on an opposingvertical edge of the circuit card 173. The connector 121 of the SSDmodule 120 is removably connected to the connector 172, and the trayconnector 171 is removably connected to a corresponding bay connector112 of a connector card 110. The circuit card 173 includes wiringconnections that allow electrical signals from the terminals of theconnector 172 to be coupled to corresponding terminals of the trayconnector 171.

In the example of FIG. 4, the circuit card 173 includes a mounting hole175 on a horizontal edge and a mounting tab 174 on an opposinghorizontal edge. To mount the interposer 170 to the frame 151, themounting tab 174 is inserted into a slot 163 of the frame 151, and themounting hole 175 is secured between the screw 158 and the standoff 159.The mounting tab 174 and the slot 163 allow for relatively easy andsecure alignment of the interposer 170 using only a single screw on onlyone horizontal edge of the circuit board 173. In the example of FIG. 4,the plate 157 has a plurality of vent holes 164 directly underneath theplane of the interposer 170. The vent holes 164 serve as a cooling ventthat allows cooling air to flow through a gap between the plate 157 andthe undersides of the SSD module 120 and the interposer 170. A pluralityof mounting holes 176 on the plate 157 allow electromagneticinterference (EMI) springs 180 (see FIGS. 5 and 6) to be mounted on theplate 157.

FIG. 5 shows a multi-view of the storage tray 150 in accordance with anembodiment of the present invention. FIG. 5 shows a top view 301, a sideview 302, and an edge view 303. The top view 301 and the edge view 303show EMI springs 180, which as noted may be installed to the storagetray 150 on the mounting holes 176 (see FIG. 4). The components labeledin FIG. 5 have been previously described with reference to FIGS. 3 and4, and are noted in FIG. 5 for orientation purposes.

FIG. 6 is a larger drawing of the edge view 303 of FIG. 5. As shown inFIG. 6, the plane of the circuit card 173 of the interposer 170 is inparallel with the plane of the plate 157, with a gap 201 between them.The standoff 159 and the tab 174/slot 163 configuration raise thecircuit card 173 away from the plate 157 to form the gap 201. The ventholes 164 (see FIG. 4) on the plate 157 allows air from the cooling unit(e.g., fans) of the storage bay 100 to flow in the gap 201 and therebycool the components of the storage tray 150. The cooling air exits fromthe gap 201 to cool other storage trays installed in the storage bay100. The EMI springs 180 compress to allow relatively tight electricalcontact with an adjacent storage tray 150 to minimize or preventelectromagnetic/radio frequency interference (RFI) in the storage bay100.

FIG. 7 shows a top view of a plurality of storage trays 150 inaccordance with an embodiment of the present invention. FIG. 7 shows therelative positions of adjacent storage trays 150 as installed in thestorage bay 100. When a plurality of storage trays 150 are installed inthe storage bay 100, an EMI spring 180 of one storage tray 150 makes anelectrical connection with a frame 151 (or other shield point) of anadjacent storage tray 150 to maintain EMI/RFI shielding.

FIG. 8 shows an arrangement of an SSD module 120, an interposer 170A,and a connector card 110A in accordance with an embodiment of thepresent invention. The interposer 170A is a particular implementation ofthe interposer 170. As before, the interposer 170A and the SSD module120 are mounted as part of a storage tray 150. An M.2 connector 121 ofthe SSD module 120 is removably connected to the connector 172 of theinterposer 170A. In the example of FIG. 8, the interposer 170A includesan edge-type tray connector 171A that is compliant with the NGSFFspecification. The circuit card 173A is a particular implementation ofthe circuit card 173. In the example of FIG. 8, the circuit card 173A ofthe interposer 170A provides wiring connections that allow electricalsignals from the terminals of the connector 172 to be coupled tocorresponding terminals of the tray connector 171A in compliance withthe NGSFF specification. Also labeled in FIG. 8 are the tab 174A andmounting hole 175A of the circuit card 173A.

In the example of FIG. 8, the connector card 110A is a particularimplementation of the connector card 110. The connector card 110A has aslot-type bay connector 112A that is configured to removably mate withthe tray connector 171A of the interposer 170A. The bay connector 112Ais compliant with the NGSFF specification. The bay terminals 113 of theconnector card 110A may comprise pins that are electrically connected toa PCIE bus on the motherboard 114. The storage tray 150 is thusadaptable to allow an NVME module that is compliant with the M.2 formfactor specification to connect to an NGSFF-compliant storage bay 100.

FIG. 9 shows an arrangement of an SSD module 120, an interposer 170B,and a connector card 110B in accordance with another embodiment of thepresent invention. The interposer 170B is a particular implementation ofthe interposer 170. As before, the interposer 170B and the SSD module120 are mounted as part of a storage tray 150. An M.2 connector 121 ofthe SSD module 120 is removably connected to the connector 172 of theinterposer 170B. In the example of FIG. 9, the interposer 170B includesan edge-type tray connector 171B that is compliant with the EDSFFspecification. The circuit card 173B is a particular implementation ofthe circuit card 173. In the example of FIG. 9, the circuit card 173B ofthe interposer 170B provides wiring connections that allow electricalsignals from the terminals of the connector 172 to be coupled tocorresponding terminals of the tray connector 171B in compliance withthe EDSFF specification. Also labeled in FIG. 9 are the tab 174B andmounting hole 175B of the circuit card 173B.

In the example of FIG. 9, the connector card 110B is a particularimplementation of the connector card 110. The connector card 110B has aslot-type bay connector 112B that is configured to removably mate withthe tray connector 171B. The bay connector 112B is compliant with theEDSFF specification. The bay terminals 113 of the connector card 110Bmay comprise pins that are electrically connected to a PCIE bus on themotherboard 114. The storage tray 150 is thus adaptable to allow an NVMEmodule that is compliant with the M.2 form factor specification toconnect to an EDSFF-compliant storage bay 100.

FIG. 10 shows a schematic diagram of an interposer 170 in accordancewith an embodiment of the present invention. As previously noted, aninterposer 170 may include a connector 172 that is removably connectedto a connector 121 of an SSD module 120, and a tray connector 171 thatis removably connected to a bay connector 112 of a connector card 110.

In the example of FIG. 10, the SSD module 120 is an NVME module that iscompliant with the M.2 form factor specification. In one embodiment, theinterposer 170 comprises wirings (e.g., PCB traces) that directlyconnect PCIE bus signal pins 310 of the SSD module 120 to correspondingPCIE bus signal pins 360 of the connector card 110. The SSD module 120further includes provisions for connecting System Management Bus (SMB)signal (e.g., clock, data) pins 320 to corresponding SMB signal pins 370of the connector card 110. In the example of FIG. 10, the interposer 170includes a level shifter circuit 306 that is configured to translate thelogic levels of SMB signals for compatibility between the SSD module 120and the connector card 110.

In the example of FIG. 10, the interposer 170 includes wirings thatdirectly connect ground reference pins 322 of the connector 121 of theSSD module 120 to ground reference pins 380 of the bay connector 112 ofthe connector card 110. The interposer 170 further includes a voltageregulator 307 that is configured to receive supply voltage from thesupply voltage pins 381 of the bay connector 112 of the connector card110, and to provide supply voltage to the supply voltage pins 321 of theconnector 121 of the SSD module 120. In one embodiment, the voltageregulator 307 is a step-down voltage regulator. As a particular example,the voltage regulator 307 may be configured to lower a 12V supplyvoltage received from the connector card 110 to 3.3V, which is providedto the SSD module 120.

In one embodiment, the interposer 170 further includes a hot-swapcircuit 308, which is configured to allow the SSD module 120 to behot-swappable to the connector card 110. More particularly, the hot-swapcircuit 308 allows an SSD module 120 that is compliant with the M.2 formfactor specification, which is not hot-swappable, to be inserted andremoved from the connector card 110 while power is provided on thesupply voltage pins 381, i.e., while the storage bay 100 remains poweredup. In one embodiment, the hot-swap circuit 308 is electricallyconnected to one or more presence pins 390 on the bay connector 112 ofthe connector card 110. Any suitable discrete or integrated circuithot-swap circuit may be employed without detracting from the merits ofthe present invention.

As can be appreciated from the foregoing, the connections shown in FIG.10 may be modified depending on the connector card 110. For example,when the connector card 110 is an NGSFF connector card (e.g., FIG. 8,110A), the SMB alert pin of the SSD module 120 for indicating to thecomputer system 190 that the SMB requires attention would be connectedto a corresponding SMB alert pin on the connector card 110, as in FIG.10. However, when the connector card 110 is an EDSFF connector card(e.g., FIG. 9, 110B), the SMB alert pin of the SSD module 120 is left asan open trace, i.e., not connected.

Embodiments of the present invention provide many advantages heretoforeunrealized. First, embodiments of the present invention allow an SSDstorage bay to receive SSD modules that are compliant with differentspecifications, thereby reducing the cost of operating and maintainingan enterprise computer system. Second, embodiments of the presentinvention allow SSD modules to have hot-swap capability. Third,embodiments of the present invention allow SSD storage bays to haveadequate cooling even with several storage trays installed.

Adaptable SSD storage bays and associated components have beendisclosed. While specific embodiments of the present invention have beenprovided, it is to be understood that these embodiments are forillustration purposes and not limiting. Many additional embodiments willbe apparent to persons of ordinary skill in the art reading thisdisclosure.

What is claimed is:
 1. A solid state drive (SSD) storage bay for acomputer system, the SSD storage bay comprising: a plurality of storagetrays, each storage tray of the plurality of storage trays comprising anSSD module and an interposer, the SSD module comprising a firstconnector of a first connector type, the interposer comprising a firstconnector of the first connector type and a second connector of a secondconnector type, wherein the first connector of the SSD module isremovably connected to the first connector of the interposer; and aplurality of bay connectors, each bay connector of the plurality of bayconnectors being of the second connector type, removably connected to asecond connector of a corresponding storage tray of the plurality ofstorage trays, and connected to a computer bus.
 2. The SSD storage bayof claim 1, wherein the interposer further comprises a plurality ofwirings that interconnect pins of the first connector of the interposerto pins of the second connector of the interposer.
 3. The SSD storagebay of claim 2, wherein a first subset of the plurality of wiringsdirectly connect a first set of pins of the first connector of theinterposer to a first set of pins of the second connector of theinterposer.
 4. The SSD storage bay of claim 2, wherein the interposerfurther comprises a voltage regulator that receives an input voltagefrom a first pin of the second connector of the interposer and providesan output voltage to a first pin of the first connector of theinterposer.
 5. The SSD storage bay of claim 4, wherein the voltageregulator is a step-down voltage regulator.
 6. The SSD storage bay ofclaim 4, wherein the voltage regulator receives a 12V input voltage fromthe first pin of the second connector of the interposer and generates a3.3V output voltage to the first pin of the first connector of theinterposer.
 7. The SSD storage bay of claim 2, wherein the interposerfurther comprises a plurality of level shifters that translate logiclevels of signals between a second set of pins of the first connector ofthe interposer and a second set of pins of the second connector of theinterposer.
 8. A solid state drive (SSD) storage bay for a computersystem, the storage bay comprising: an SSD module comprising a firstconnector; an interposer comprising a first connector that is removablyconnected to the first connector of the SSD module, a second connector,a voltage regulator, and a plurality of wirings that connect a pluralityof pins of the first connector of the interposer to a plurality of pinsof the second connector of the interposer; a motherboard; and a bayconnector that is connected to the motherboard and the second connectorof the interposer, wherein the voltage regulator is configured toreceive an input voltage from a first pin of the second connector of theinterposer and provide an output voltage at a first pin of the firstconnector of the interposer.
 9. The SSD storage bay of claim 8, whereinthe voltage regulator is a step-down voltage regulator.
 10. The SSDstorage bay of claim 8, wherein the voltage regulator receives a 12Vinput voltage from the first pin of the second connector of theinterposer and generates a 3.3V output voltage to the first pin of thefirst connector of the interposer.
 11. The SSD storage bay of claim 8,wherein a first set of wirings of the plurality of wirings of theinterposer connect a first set of pins of the first connector of theinterposer directly to a corresponding first set of pins of the secondconnector of the interposer.
 12. The SSD storage bay of claim 11,further comprising a plurality of level shifters that are configured totranslate logic levels of signals between a second set of pins of thefirst connector of the interposer and a second set of pins of the secondconnector of the interposer.
 13. The SSD storage bay of claim 8, furthercomprising a frame that has a plurality of vent holes that face a planeof the interposer.
 14. A storage tray for a solid state drive (SSD)storage bay, the storage tray comprising: a frame having a first endthat is configured to face towards a bay connector of the SSD storagetray and a second end that is opposite the first end, the framecomprising an ejector for facilitating removal of the storage tray fromthe SSD storage bay, the ejector being attached to the second end; anSSD module that is attached to the frame, the SSD module comprising afirst connector of a first connector type; and an interposer that isattached to the frame, the interposer comprising a first connector ofthe first connector type, a second connector of a second connector typeand configured to be removably connected to the bay connector, and avoltage regulator, wherein the first connector of the SSD module isremovably connected to the first connector of the interposer, and thevoltage regulator is configured to receive an input voltage from a firstpin of the second connector of the interposer and to generate an outputvoltage at a first pin of the first connector of the interposer.
 15. Thestorage tray of claim 14, wherein the interposer further comprises aplurality of wirings that connect a plurality of pins of the firstconnector of the interposer to a plurality of pins of the secondconnector of the interposer.
 16. The storage tray of claim 15, whereinthe ejector comprises a lever that is rotatably mounted on the frame.17. The storage tray of claim 14, further comprising an electromagneticinterference (EMI) spring that is connected to the frame.
 18. Thestorage tray of claim 14, wherein the interposer further comprises: ahot-swap circuit between a second pin of the second connector of theinterposer and a second pin of the first connector of the interposer.19. The storage tray of claim 14, wherein the frame includes a pluralityof vent holes that are positioned in front of a plane of the interposer,and further comprising a standoff that raises the interposer away fromthe frame such that an air gap is formed between the vent holes and theplane of the interposer.
 20. The storage tray of claim 19, wherein theplurality of vent holes are formed through a plate of the frame.